Infineon BSP Type P-Channel MOSFET, 680 mA, -100 V Enhancement, 3-Pin SOT-223 BSP316PH6327XTSA1

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Subtotal (1 reel of 1000 units)*

MYR1,392.00

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Units
Per Unit
Per Reel*
1000 - 1000MYR1.392MYR1,392.00
2000 - 2000MYR1.35MYR1,350.00
3000 +MYR1.296MYR1,296.00

*price indicative

RS Stock No.:
250-0535
Mfr. Part No.:
BSP316PH6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

680mA

Maximum Drain Source Voltage Vds

-100V

Series

BSP

Package Type

SOT-223

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

1800mΩ

Channel Mode

Enhancement

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

80nC

Maximum Power Dissipation Pd

81W

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Infineon BSP Series MOSFET, 100V Maximum Drain‑Source Voltage, +150°C Maximum Operating Temperature - BSP316PH6327XTSA1


This p‑channel MOSFET is a surface‑mount transistor designed for power switching in temperature‑demanding environments. It operates across a wide thermal range and is intended for applications requiring controlled drain‑source conduction with moderate continuous current capability. The component meets automotive screening and environmental restrictions for use where standards compliance is required.

Features and Benefits:


• 1800mΩ Rds(on) reduces conduction losses and simplifies thermal design
• 0.68A continuous drain current supports low‑to‑moderate load switching
• 80nC typical gate charge enables Faster gate transitions with lower drive energy
• 81W power dissipation allows sustained energy handling in constrained packages
• +150°C maximum operating temperature permits use in high‑temperature assemblies

Applications


• Suitable for automotive subsystem power management
• Ideal for surface‑mount regulator and load‑switch circuits
• Used with battery management and low‑current switching modules
• Can be used for thermal‑tolerant power‑path control on Compact boards
• Suitable for designs requiring RoHS‑compliant P‑channel components

What gate voltage limits must be observed during operation?


The device accepts up to 20V between gate and source and should not exceed that value.

What package and mounting style does it use for PCB integration?


It is supplied in a SOT‑223 package intended for surface mounting to aid thermal coupling.

What electrothermal behaviour applies for sustained dissipation?


The part is rated to dissipate up to 81W under specified conditions but requires appropriate PCB thermal management.

Is the device qualified for automotive environments?


It complies with AEC‑Q101 standards for automotive‑grade semiconductor screening.

What environmental restriction standard does it meet?


The component is RoHS compliant, meeting lead‑free and restricted‑substance requirements.

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