Infineon OptiMOS Type N-Channel MOSFET, 190 mA, 100 V Enhancement, 3-Pin SOT-23 BSS123NH6433XTMA1
- RS Stock No.:
- 165-5732
- Mfr. Part No.:
- BSS123NH6433XTMA1
- Manufacturer:
- Infineon
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MYR2,780.00
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Units | Per Unit | Per Reel* |
|---|---|---|
| 10000 - 10000 | MYR0.278 | MYR2,780.00 |
| 20000 + | MYR0.272 | MYR2,720.00 |
*price indicative
- RS Stock No.:
- 165-5732
- Mfr. Part No.:
- BSS123NH6433XTMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 190mA | |
| Maximum Drain Source Voltage Vds | 100V | |
| Series | OptiMOS | |
| Package Type | SOT-23 | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 10Ω | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 0.8V | |
| Maximum Power Dissipation Pd | 500mW | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 0.6nC | |
| Maximum Operating Temperature | 150°C | |
| Height | 1mm | |
| Standards/Approvals | No | |
| Length | 2.9mm | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 190mA | ||
Maximum Drain Source Voltage Vds 100V | ||
Series OptiMOS | ||
Package Type SOT-23 | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 10Ω | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 0.8V | ||
Maximum Power Dissipation Pd 500mW | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 0.6nC | ||
Maximum Operating Temperature 150°C | ||
Height 1mm | ||
Standards/Approvals No | ||
Length 2.9mm | ||
Automotive Standard AEC-Q101 | ||
RoHS Status: Not Applicable
- COO (Country of Origin):
- CN
Infineon OptiMOS Series MOSFET, 100V Maximum Drain Source Voltage, 10Ω Maximum Drain Source Resistance - BSS123NH6327XTSA1
This MOSFET is a surface-mount N-channel enhancement transistor designed for switching and control tasks in compact electronic assemblies. It is intended for use across a wide thermal range and in applications where low switching charge and conservative current handling are required. The device is supplied in a SOT-23 package for straightforward PCB mounting and is suitable for environments that demand automotive-grade component robustness.
Features and Benefits:
• 100V drain-source rating enables high-voltage switching capability
• 10Ω Rds(on) simplifies low-power protection and current limiting
• 0.6nC typical gate charge minimises switching losses
• 190mA continuous drain current supports light-load control
• 20V gate voltage rating allows compatibility with common drive levels
• 500mW power dissipation handles modest thermal loads
• 10Ω Rds(on) simplifies low-power protection and current limiting
• 0.6nC typical gate charge minimises switching losses
• 190mA continuous drain current supports light-load control
• 20V gate voltage rating allows compatibility with common drive levels
• 500mW power dissipation handles modest thermal loads
Applications
• Suitable for battery management sensing circuits
• Ideal for low-current load switching in control modules
• Used with level-shift interfaces in mixed-voltage systems
• Can be used for signal isolation in automotive peripherals
• Appropriate for thermal-limited power distribution networks
• Ideal for low-current load switching in control modules
• Used with level-shift interfaces in mixed-voltage systems
• Can be used for signal isolation in automotive peripherals
• Appropriate for thermal-limited power distribution networks
What temperature conditions can it withstand in operation?
It operates across a broad range from -55°C up to 150°C, permitting use in both cold-start and high-heat environments.
What mounting and pin configuration does it use?
It is supplied as a three-pin SOT-23 surface-mount package, optimised for automated PCB assembly and small form-factor layouts.
How does its construction influence selection for automotive projects?
The device meets an automotive stress test standard, making it suitable where components must tolerate automotive qualification requirements.
How should thermal dissipation be managed on a PCB?
With a 500mW dissipation limit, designers should provide adequate copper area or thermal vias to spread heat and maintain junction temperatures within safe limits.
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