Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS Stock No.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
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Subtotal (1 unit)*
MYR30.64
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- Shipping from 02 March 2026
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Units | Per Unit |
|---|---|
| 1 - 93 | MYR30.64 |
| 94 - 187 | MYR29.33 |
| 188 + | MYR27.59 |
*price indicative
- RS Stock No.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 50 | |
| Number of Rows | 2 | |
| Sub Type | Socket Assembly | |
| Current | 2.7A | |
| Pitch | 0.8mm | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 22mm | |
| Voltage | 339 V | |
| Series | ASP | |
| Row Pitch | 3.36mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Female | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold over Nickel | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Sub Type Socket Assembly | ||
Current 2.7A | ||
Pitch 0.8mm | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 22mm | ||
Voltage 339 V | ||
Series ASP | ||
Row Pitch 3.36mm | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Female | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold over Nickel | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
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