Molex 3099 Series Vertical Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-520
- Mfr. Part No.:
- 22-15-2086
- Manufacturer:
- Molex
N
Subtotal (1 bag of 300 units)*
MYR1,655.33
Stock information currently inaccessible - Please check back later
Bag(s) | Per Bag | Per Unit* |
|---|---|---|
| 1 + | MYR1,655.33 | MYR5.518 |
*price indicative
- RS Stock No.:
- 787-520
- Mfr. Part No.:
- 22-15-2086
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 3099 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Number of Contacts | 8 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 3099 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Number of Contacts 8 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Features robust construction for enhanced durability in harsh environments
Supports efficient wire-to-board connectivity, optimising space in designs
Compatible with a wide range of configurations to meet diverse application needs
Offers user-friendly engagement to simplify installation and maintenance
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