Molex 3099 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-514
- Mfr. Part No.:
- 22-14-2104
- Manufacturer:
- Molex
N
Subtotal (1 tray of 200 units)*
MYR1,399.69
Stock information currently inaccessible - Please check back later
Tray(s) | Per Tray | Per Unit* |
|---|---|---|
| 1 + | MYR1,399.69 | MYR6.998 |
*price indicative
- RS Stock No.:
- 787-514
- Mfr. Part No.:
- 22-14-2104
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 3099 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Housing Material | Nylon | |
| Number of Contacts | 10 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 3099 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Housing Material Nylon | ||
Number of Contacts 10 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex PCB Header is designed for reliable and efficient electrical connections in various applications. They ensure secure connections between circuit boards and other devices.
Available in multiple standards for flexibility in design
Optimised for high-performance environments to enhance reliability
Facilitates easy assembly and maintenance, reducing downtime
Offers diverse configurations to meet specific connectivity needs
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