Molex 850 μm Pitch 288 Way, Vertical Through Hole Mount DDR4 Socket ,29V, 750mA
- RS Stock No.:
- 691-846
- Mfr. Part No.:
- 78726-1005
- Manufacturer:
- Molex
Subtotal (1 tray of 10 units)*
MYR1,323.54
Stock information currently inaccessible - Please check back later
Tray(s) | Per Tray | Per Unit* |
|---|---|---|
| 1 + | MYR1,323.54 | MYR132.354 |
*price indicative
- RS Stock No.:
- 691-846
- Mfr. Part No.:
- 78726-1005
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Memory Socket Type | DIMM | |
| Product Type | Socket | |
| Orientation | Vertical | |
| Insertion/Removal Method | Latched | |
| Contact Material | Copper Alloy | |
| Current | 750mA | |
| Contact Plating | Gold | |
| Number of Contacts | 288 | |
| Pitch | 850μm | |
| Mount Type | Through Hole | |
| Housing Material | Nylon | |
| SDRAM Type | DDR4 | |
| Latching | Yes | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Through Hole | |
| Row Spacing | 1.58mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | CSA LR19980 | |
| Series | 78726 | |
| Voltage | 29V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Memory Socket Type DIMM | ||
Product Type Socket | ||
Orientation Vertical | ||
Insertion/Removal Method Latched | ||
Contact Material Copper Alloy | ||
Current 750mA | ||
Contact Plating Gold | ||
Number of Contacts 288 | ||
Pitch 850μm | ||
Mount Type Through Hole | ||
Housing Material Nylon | ||
SDRAM Type DDR4 | ||
Latching Yes | ||
Minimum Operating Temperature -55°C | ||
Termination Type Through Hole | ||
Row Spacing 1.58mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals CSA LR19980 | ||
Series 78726 | ||
Voltage 29V | ||
- COO (Country of Origin):
- CN
The Molex DDR4 DIMM Socket is designed for robust and reliable memory module applications. Featuring a vertical through-hole design, it accommodates 288 circuits, ensuring optimal connection and performance in a Compact form factor. With a PCB thickness of 2.36mm and a tail length of 3.18mm, this socket is adept at integrating seamlessly into various circuitry setups. The Durable construction includes a copper alloy with gold plating, offering excellent conductivity and mitigated corrosion risks. With an operating temperature range of -55° to +85°C, this product is engineered to perform in a variety of environmental conditions. Given its classified status as obsolete, this socket is a testament to quality and reliability in memory Interface technology.
Vertical through-hole design for space-efficient integration
288 circuits provide high density connections
Premium gold plating ensures optimal conductivity and durability
Operating temperature range of -55° to +85°C for versatile application
Copper alloy construction offers strength and resilience
Nylon resin housing enhances structural integrity
Designed for compatibility with standard PCB thickness of 2.36mm
Easy installation and reliable retention via its robust latch mechanism
Related links
- Molex 0.85 mm Pitch 288 Way29V, 750mA
- Molex 0.85 mm Pitch 288 Way29V, 750mA
- Molex 0.85 mm Pitch 288 Way29Vrms, 750mA
- Molex 0.85 mm Pitch 288 Way, Straight Surface Mount DDR4 DIMM Socket
- TE Connectivity 0.85 mm Pitch 288 Way1.2V, 750mA
- TE Connectivity 0.85 mm Pitch 288 Way25V, 750mA
- Molex 0.5 mm Pitch 288 Way29 V ac 750mA
- Molex Vertical 18 Row, 288 Way