Infineon IKZ75N65EH5XKSA1, Type N-Channel IGBT, 90 A 650 V, 4-Pin TO-247, Through Hole
- RS Stock No.:
- 273-2988
- Mfr. Part No.:
- IKZ75N65EH5XKSA1
- Manufacturer:
- Infineon
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| 1 - 4 | MYR30.91 |
| 5 - 9 | MYR30.33 |
| 10 - 24 | MYR28.12 |
| 25 - 49 | MYR25.81 |
| 50 + | MYR23.84 |
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- RS Stock No.:
- 273-2988
- Mfr. Part No.:
- IKZ75N65EH5XKSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 90A | |
| Maximum Collector Emitter Voltage Vceo | 650V | |
| Maximum Power Dissipation Pd | 395W | |
| Package Type | TO-247 | |
| Mount Type | Through Hole | |
| Channel Type | Type N | |
| Pin Count | 4 | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.65V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Series | IKZ | |
| Width | 16.13mm | |
| Length | 21.1mm | |
| Height | 5.21mm | |
| Standards/Approvals | JEDEC, RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 90A | ||
Maximum Collector Emitter Voltage Vceo 650V | ||
Maximum Power Dissipation Pd 395W | ||
Package Type TO-247 | ||
Mount Type Through Hole | ||
Channel Type Type N | ||
Pin Count 4 | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.65V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Series IKZ | ||
Width 16.13mm | ||
Length 21.1mm | ||
Height 5.21mm | ||
Standards/Approvals JEDEC, RoHS | ||
Automotive Standard No | ||
Infineon IKZ Series IGBT, 90A Maximum Continuous Collector Current, 650V Maximum Gate-Emitter Voltage - IKZ75N65EH5XKSA1
This IGBT is a high-voltage switching semiconductor intended for power conversion and control tasks. It operates across a broad thermal range and is supplied in a through-hole TO-247 package suited to systems requiring robust mounting and straightforward thermal interfacing. The device meets common industry approvals and is designed for applications demanding substantial continuous current handling and elevated gate-emitter voltage capability.
Features and Benefits:
• 90A continuous collector current delivers sustained high-current switching capacity
• 650V gate-emitter rating enables high-voltage switching applications
• 1.65V maximum VceSAT reduces conduction losses in driven loads
• 395W power dissipation supports heavy-duty thermal loading
• -40°C to 175°C operating range permits wide-temperature deployment
• 650V gate-emitter rating enables high-voltage switching applications
• 1.65V maximum VceSAT reduces conduction losses in driven loads
• 395W power dissipation supports heavy-duty thermal loading
• -40°C to 175°C operating range permits wide-temperature deployment
Applications
• Suitable for motor drive inverter stages
• Ideal for industrial power converters and UPS systems
• Used with high-voltage DC link switching topologies
• Can be used for traction and heavy-vehicle power modules
• Useful in laboratory power electronics test rigs
• Ideal for industrial power converters and UPS systems
• Used with high-voltage DC link switching topologies
• Can be used for traction and heavy-vehicle power modules
• Useful in laboratory power electronics test rigs
What mounting method is required for secure installation?
The component is provided in a through-hole TO-247 package for secure board fastening and direct heatsink attachment.
Which approvals indicate compatibility with industry manufacturing standards?
It is approved to JEDEC criteria and conforms to RoHS substance restrictions.
How does the device cope with thermal stress during operation?
The maximum power dissipation rating of 395W defines its thermal load handling when mounted with appropriate cooling measures.
What pin count must be considered when designing the PCB footprint?
The device utilises a four-pin arrangement that should be accommodated in the PCB layout.
Is this component designed to automotive specification levels?
It is not classified to automotive standards and should not be assumed compliant for automotive-qualified systems.
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