Vishay IGBR Series 2.5 Ω, 0202 Thin Film Resistor 0.05 Solder 4 W - IGBRC5000CJJSAT5
- RS Stock No.:
- 859-327
- Mfr. Part No.:
- IGBRC5000CJJSAT5
- Manufacturer:
- Vishay
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MYR13.21
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Tape(s) | Per Tape |
|---|---|
| 1 - 9 | MYR13.21 |
| 10 - 24 | MYR11.08 |
| 25 - 99 | MYR8.20 |
| 100 - 499 | MYR5.95 |
| 500 + | MYR5.82 |
*price indicative
- RS Stock No.:
- 859-327
- Mfr. Part No.:
- IGBRC5000CJJSAT5
- Manufacturer:
- Vishay
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Product Type | Resistor | |
| Resistance | 2.5Ω | |
| Resistor Type | Thin Film Resistor | |
| Technology | Thin Film | |
| Package/Case | 0202 | |
| Packaging | Waffle Pack | |
| Tolerance | 0.05 | |
| Power Rating | 4W | |
| Voltage | 75V | |
| Temperature Coefficient | ± 500 ppm/°C | |
| Mount Type | Solder | |
| Automotive Standard | AEC-Q200 | |
| Pin Count | 1 | |
| Series | IGBR Series | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 200°C | |
| Height | 0.01in | |
| Termination Style | Wire | |
| Standards/Approvals | AEC-Q200 Qualified | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Product Type Resistor | ||
Resistance 2.5Ω | ||
Resistor Type Thin Film Resistor | ||
Technology Thin Film | ||
Package/Case 0202 | ||
Packaging Waffle Pack | ||
Tolerance 0.05 | ||
Power Rating 4W | ||
Voltage 75V | ||
Temperature Coefficient ± 500 ppm/°C | ||
Mount Type Solder | ||
Automotive Standard AEC-Q200 | ||
Pin Count 1 | ||
Series IGBR Series | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 200°C | ||
Height 0.01in | ||
Termination Style Wire | ||
Standards/Approvals AEC-Q200 Qualified | ||
- COO (Country of Origin):
- GB
The Vishay high power back-contact resistor is designed for efficient thermal management and space-saving applications, functioning effectively at elevated temperatures up to 200 °C.
AEC-Q200 qualified for automotive applications
Utilises Advanced thermal properties of silicon to ensure reliability
Offers various attachment options including sintering, soldering, and epoxy
Features a back contact design for reduced hybrid space and easier assembly
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