Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 24 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header is essential for precise and reliable connectivity between electronic components. Part of the Micro-Fit 3.0 connector system, it supports seamless wire-to-board applications. The shrouded design enhances connection stability, making it suitable for challenging environments. With a current handling capability of up to 8.5A, it adheres to rigorous performance standards in the automation and electronics sectors.

• Dual row configuration optimises space on PCB layouts
• Designed for through hole mounting with kinked pins for added stability
• Durable brass contacts provide long-lasting performance

• Power transmission in electronic devices
• Connections in automation machinery
• PCB assemblies requiring strong connectivity

It is advised to use a PCB thickness of 1.60mm for optimal performance.

This product operates effectively in temperatures from -40°C to +105°C and is suitable for high-temperature applications.

The connector is rated for up to 30 mating cycles, ensuring performance during regular use.

The maximum voltage rating is 600V, making it appropriate for a wide range of electrical applications.

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Molex Micro-Fit 3.0 Series