Specifications

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Product Details

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Select all	Attribute	Value
	Brand	Amphenol Communications Solutions
	Product Type	Pin Header
	Series	Bergstik
	Pitch	2.54mm
	Current	3A
	Number of Contacts	3
	Number of Rows	1
	Shrouded/Unshrouded	Unshrouded
	Mount Type	Through Hole
	Contact Material	Phosphor Bronze
	Termination Type	Solder
	Row Pitch	2.54mm
	Standards/Approvals	No

	Select all
	Brand Amphenol Communications Solutions
	Product Type Pin Header
	Series Bergstik
	Pitch 2.54mm
	Current 3A
	Number of Contacts 3
	Number of Rows 1
	Shrouded/Unshrouded Unshrouded
	Mount Type Through Hole
	Contact Material Phosphor Bronze
	Termination Type Solder
	Row Pitch 2.54mm
	Standards/Approvals No

Datasheet - 77311-101-03LF

COO (Country of Origin):: FR

The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.

High temperature thermoplastic material

Reflow compatible

Variable spacing height for stacking headers

Cater to a wide range of applications

Allow dual entry, mating from top or bottom

Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54 mm Pitch, 1 Row,

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