Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 10 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header facilitates effective wire-to-board connectivity across various applications. Part of the Micro-Fit 3.0™ series, it features a vertical shrouded configuration for reliable performance, particularly suitable for high-current requirements. This connector is integral for establishing robust electrical connections while adhering to efficiency and safety standards.

• Glow wire compatible, contributing to enhanced safety in electrical systems
• Tin plated brass contacts ensure optimal conductivity
• Compatible with through-hole mounting for secure installation

• Suitable for connecting power circuits in electronic assemblies
• Utilised in consumer electronics for dependable connectivity
• Commonly used in automotive wiring systems
• Important for PCB designs requiring high-temperature resilience

The connector functions effectively within a temperature range of -40°C to +105°C, ensuring operation in diverse environments.

It supports up to 30 mating cycles, providing durability for repeated use.

It is recommended for use with PCB thicknesses of 1.60mm for a secure fit.

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Molex Micro-Fit 3.0 Series