Molex 15-91 Series Vertical Surface Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS Stock No.:
- 817-094
- Mfr. Part No.:
- 15-91-0140
- Manufacturer:
- Molex
N
Subtotal (1 pack of 250 units)*
MYR1,280.50
Stock information currently inaccessible - Please check back later
Pack(s) | Per Pack | Per Unit* |
|---|---|---|
| 1 + | MYR1,280.50 | MYR5.122 |
*price indicative
- RS Stock No.:
- 817-094
- Mfr. Part No.:
- 15-91-0140
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 15-91 | |
| Product Type | Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 14 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 120°C | |
| Standards/Approvals | RoHS | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 15-91 | ||
Product Type Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Thermoplastic | ||
Number of Contacts 14 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 120°C | ||
Standards/Approvals RoHS | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex 2.54mm Pitch C-Grid is a breakaway header is designed for surface mount applications, featuring a dual-row vertical configuration with 14 circuits and selective gold plating for reliable connectivity in electronic assemblies.
Dual-row design allows for efficient space utilisation on PCBs
High-temperature thermoplastic resin contributes to durability
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