Molex 5045 Series Vertical Through Hole PCB Header, 11 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 786-586
- Mfr. Part No.:
- 22-04-1111
- Manufacturer:
- Molex
N
Subtotal (1 bag of 1200 units)*
MYR1,356.48
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- Shipping from 22 October 2026
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Bag(s) | Per Bag | Per Unit* |
|---|---|---|
| 1 + | MYR1,356.48 | MYR1.13 |
*price indicative
- RS Stock No.:
- 786-586
- Mfr. Part No.:
- 22-04-1111
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 5045 | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 11 | |
| Housing Material | Polyamide | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Row Pitch | 1mm | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 5045 | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 11 | ||
Housing Material Polyamide | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Row Pitch 1mm | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 250V | ||
- COO (Country of Origin):
- KR
The Molex Wire to board Header is designed for seamless electrical connections in various applications. This component plays a Crucial role in ensuring reliable performance within electronic assemblies.
High-quality materials enhance durability and optimal performance
Various connector types available, including board-to-board and wire-to-board options
Compact design promotes efficient use of space in electronic assemblies
Easy integration with existing systems, ensuring versatile application across industries
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