Molex 87760 Series Right Angle Through Hole PCB Header, 44 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Subtotal (1 tray of 60 units)*

MYR1,169.24

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1 +MYR1,169.24MYR19.487

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
693-671
Mfr. Part No.:
87760-4416
Manufacturer:
Molex
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Brand

Molex

Series

87760

Product Type

PCB Header

Pitch

2mm

Current

2A

Number of Contacts

44

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Mount Type

Through Hole

Connector System

Wire to Board Signal

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Through Hole

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.60mm

Contact Gender

Male

Standards/Approvals

CSA LR19980, UL E29179

Voltage

125V

COO (Country of Origin):
ID
The Molex Milli Grid Header is designed to facilitate reliable connections in Advanced electronic applications. This 2.00mm pitch, right-angle, through-hole connector provides a sturdy Interface with 44 circuits and is Ideal for board-to-board and wire-to-board applications. Constructed with high-quality phosphor bronze and featuring selective gold plating, the header ensures excellent conductivity and durability. It boasts a lead-free design, ensuring compliance with environmental regulations while meeting the needs of modern PCB assembly. The product is packaged in a tray for easy handling and storage, making it an essential component in any engineering toolkit.

Active status, ensuring the latest design capabilities
Designed for PCB headers and receptacles, supporting versatile applications
Lead-free construction aligns with industry environmental standards
Compatible with various PCB receptacles for expanded connectivity options
High-temperature thermoplastic resin provides robustness against heat
Mated height of 4.00mm optimises space on crowded boards
Tray packaging promotes efficient storage and easy access during assembly
Stackable design enables Compact configurations without sacrificing performance

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