Molex 46207 Series Vertical Through Hole PCB Header, 8 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

N

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Subtotal (1 tray of 120 units)*

MYR1,279.22

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1 +MYR1,279.22MYR10.66

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
691-895
Mfr. Part No.:
46207-1108
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

46207

Pitch

4.20mm

Current

13A

Housing Material

High Temperature Thermoplastic

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Board to Board Connectivity

Contact Material

Brass

Contact Plating

Matte Tin

Termination Type

Through Hole

Row Pitch

4.20mm

Minimum Operating Temperature

-40°C

Tail Pin Length

4.46mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR19980, UL E29179

COO (Country of Origin):
MX
The Molex Mini-Fit Jr. PCB header designed for dual-row, vertical assembly with an 8-circuit configuration. Engineered for optimal performance, it is suitable for various applications including board-to-board, power, and wire-to-board connections. This header supports a PCB thickness of 2.36mm and is capable of withstanding rigorous soldering processes, making it a perfect choice for high-density electronic designs. With features like glow-wire capability and compliance with industry standards, this product ensures both durability and safety, all while providing a Compact solution for modern connectivity needs.

8-circuit capacity allows for efficient space utilisation on PCBs
Designed for wire-to-wire and wire-to-board applications with a maximum current of 13.0A
Matte tin plating provides excellent electrical conductivity and ensures a reliable connection
Vertical orientation supports Compact designs, saving space without compromising functionality
Compatible with a range of Mini-Fit receptacle housings, ensuring versatility in circuit designs
Rated for operating temperatures from -40° to +105°C, suitable for a variety of environments
Lightweight design 2.914g facilitates easier handling and installation

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