Molex 5569 Series Right Angle Through Hole Connector, 16 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

N

Subtotal (1 tray of 80 units)*

MYR1,210.44

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1 +MYR1,210.44MYR15.131

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
691-712
Mfr. Part No.:
50-36-2426
Manufacturer:
Molex
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Brand

Molex

Product Type

Connector

Series

5569

Current

13A

Pitch

4.20mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

16

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Matte Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Row Pitch

4.20mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.50mm

Standards/Approvals

UL E29179, CSA LR19980

COO (Country of Origin):
MX
The Molex Mini-Fit Jr. Header is designed for optimal power and wire-to-board connectivity, featuring a dual-row configuration with 16 circuits for reliable performance in various applications. Crafted with an LCP housing rated to 94V-0, this right-angle header is not only robust but also glow-wire capable for enhanced safety. Its precise build caters to up to 13A per circuit when mated with compatible receptacles, ensuring high efficiency in power-sensitive environments. Perfect for PCB placement with a recommended thickness of 1.78mm and available in an elegant black resin, this component is well-suited for demanding electrical applications requiring a Durable and effective interconnect solution.

Dual-row design enabling 16 circuits for efficient power distribution
Compatible with 45750 Mini-Fit Plus HCS Crimp Terminal for optimal current handling
Glow-wire capable, enhancing safety for high-temperature applications
Enables seamless through-hole termination for reliable PCB connections
Maximum operational temperature range of -40° to +105°C, Ideal for diverse environments
Matte tin plating ensures excellent conductivity while resisting corrosion
Lightweight at just 6.730 grams for practical application in various devices

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