Molex 46207 Series Vertical Through Hole PCB Header, 8 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

N

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Subtotal (1 tray of 120 units)*

MYR1,279.22

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Per Unit*
1 +MYR1,279.22MYR10.66

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
691-699
Mfr. Part No.:
46207-0208
Manufacturer:
Molex
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Brand

Molex

Series

46207

Product Type

PCB Header

Pitch

4.20mm

Current

9A

Housing Material

LCP

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Power

Contact Material

Brass

Contact Plating

Matte Tin

Minimum Operating Temperature

-40°C

Termination Type

Through Hole

Maximum Operating Temperature

105°C

Tail Pin Length

5.26mm

Standards/Approvals

CSA LR19980, UL E29179

COO (Country of Origin):
MX
The Molex Mini-Fit Jr. Reflow Solder Capable Header is expertly designed for robust electrical connections in board-to-board and wire-to-board applications. Featuring a Compact 4.20mm pitch and accommodating up to eight circuits, this dual-row vertical header ensures optimal performance for complex connectivity needs. Constructed with high-temperature thermoplastic and brass materials, it meets stringent durability standards, making it suitable for varied environments surpassing -40° to +105°C. Enhanced with PCB pegs for secure mounting and low-halogen compliance, this header prioritises safety without compromising functionality. With a maximum voltage capacity of 600V AC/DC and supporting a maximum current of 13.0A per contact, this reliable component stands out for its efficiency and long-lasting capability.

Compact design with a 4.20mm pitch supports space-efficient layouts
Reflow solder capable for versatile installation methods
Handles a maximum current of 13.0A per circuit, ensuring effective power delivery
Rated for up to 600V AC/DC, providing flexibility for various applications
Constructed from heat-resistant thermoplastic for high-performance durability
Dual-row vertical orientation optimises component arrangement
Integrated PCB pegs enhance securing capability during installation

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