Phoenix Contact MCDN Series Straight Wave Soldering Mount PCB Header, 30 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

View all PCB Headers

Subtotal (1 pack of 40 units)*

MYR5,353.21

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 09 February 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per Unit*
1 +MYR5,353.21MYR133.83

*price indicative

SEA- RSPROC&C-PDP-1025
RS Stock No.:
556-625
Mfr. Part No.:
1953842
Manufacturer:
Phoenix Contact
Find similar products by selecting one or more attributes.
Select all

Brand

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Current

8A

Pitch

3.5mm

Number of Contacts

30

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON FMC 1

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

100°C

Tail Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Mating Pin Length

2.6mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header offers an advanced solution for connecting multiple circuits seamlessly. Engineered for integration into the SMT soldering process, this versatile component is designed to meet the demanding needs of modern electronic devices. Its compact structure allows for a high contact density while maintaining a robust performance across a variety of applications. With features tailored for through-hole reflow technology, the product’s reliability is underscored by its rich specifications, making it an ideal choice for manufacturers seeking efficiency and effectiveness. The reliable connection ensures optimal functionality, while its carefully selected materials guarantee compliance with international standards, catering to both performance and environmental considerations.

Designed for flexible device integration with various connection technologies

Facilitates higher contact density through multi-level conductor connection

Optimised for both reflow and wave soldering techniques

Lightweight design contributes to easier handling and assembly

RoHS-compliant, ensuring environmental sustainability

Features linear pinning for enhanced stability during operation

Accommodates a diverse range of applications within electronic circuitry

Superior electrical properties enhance overall performance

Packaging is efficient, minimising waste and supporting eco-friendly practices

Related links