Broadcom HCPL-0201-000E DC Input Optocoupler, Surface, 8-Pin SOIC
- RS Stock No.:
- 547-3958
- Mfr. Part No.:
- HCPL-0201-000E
- Manufacturer:
- Broadcom
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Units | Per Unit |
|---|---|
| 1 - 24 | MYR14.38 |
| 25 - 49 | MYR13.20 |
| 50 + | MYR12.59 |
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- RS Stock No.:
- 547-3958
- Mfr. Part No.:
- HCPL-0201-000E
- Manufacturer:
- Broadcom
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Broadcom | |
| Product Type | Optocoupler | |
| Mount Type | Surface | |
| Maximum Forward Voltage | 1.85V | |
| Packaging | Tape & Reel | |
| Number of Channels | 1 | |
| Number of Pins | 8 | |
| Package Type | SOIC | |
| Input Current Type | DC | |
| Typical Rise Time | 30ns | |
| Maximum Input Current | 10mA | |
| Isolation Voltage | 3750V ac | |
| Minimum Operating Temperature | -40°C | |
| Logic Output | Yes | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | IEC/EN/DIN EN 60747-5-2, UL1577, CSA | |
| Typical Fall Time | 7ns | |
| Series | HCPL | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Broadcom | ||
Product Type Optocoupler | ||
Mount Type Surface | ||
Maximum Forward Voltage 1.85V | ||
Packaging Tape & Reel | ||
Number of Channels 1 | ||
Number of Pins 8 | ||
Package Type SOIC | ||
Input Current Type DC | ||
Typical Rise Time 30ns | ||
Maximum Input Current 10mA | ||
Isolation Voltage 3750V ac | ||
Minimum Operating Temperature -40°C | ||
Logic Output Yes | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals IEC/EN/DIN EN 60747-5-2, UL1577, CSA | ||
Typical Fall Time 7ns | ||
Series HCPL | ||
Automotive Standard No | ||
Broadcom HCPL Series Optocoupler, 3750V Isolation Voltage, -40°C Minimum Operating Temperature - HCPL-0201-000E
This optocoupler provides galvanic separation between input and output for signal isolation in electronic systems. It is designed for surface PCB mounting in an 8-pin SOIC package and operates across a broad temperature range, making it suitable for general industrial applications requiring a logic-level output.
Features and Benefits:
• 3750Vac isolation enhances protection between circuits
• 30ns rise time enables fast digital signal transmission
• 7ns fall time reduces signal settling and latency
• 10mA maximum input supports low-drive control circuits
• 1.85V maximum forward voltage minimises LED drive requirements
• Surface mount SOIC package supports automated assembly
• 30ns rise time enables fast digital signal transmission
• 7ns fall time reduces signal settling and latency
• 10mA maximum input supports low-drive control circuits
• 1.85V maximum forward voltage minimises LED drive requirements
• Surface mount SOIC package supports automated assembly
Applications
• Suitable for isolating microcontroller logic from power stages
• Ideal for fast digital Interface level translation
• Used for protecting measurement circuitry from high‑voltage transients
• Can be used for single-channel industrial signal isolation
• Suitable for tape-and-reel pick-and-place production
• Ideal for fast digital Interface level translation
• Used for protecting measurement circuitry from high‑voltage transients
• Can be used for single-channel industrial signal isolation
• Suitable for tape-and-reel pick-and-place production
What mounting method is recommended for Compact PCBs?
The device is intended for surface-mount assembly in an SOIC footprint suitable for automated PCB processes.
How does the input behave in low-current drive environments?
The input is specified for DC operation with a maximum drive of 10mA, allowing use with modest current drive sources.
What temperature extremes can the component withstand during operation?
It is rated to operate from -40°C up to 85°C, permitting use in a wide range of ambient conditions.
Does the output provide a direct logic-compatible signal?
Yes, the output is a logic-type output designed to Interface with digital circuits.
How is the component supplied for volume manufacturing?
It is packaged on tape and reel to support high-throughput surface-mount assembly.
Approvals
UL E55361