Infineon CoolSiC Trench MOSFET Type N-Channel MOSFET, 150 A, 1200 V Enhancement EasyDUAL FF6MR12W2M1HPB11BPSA1
- RS Stock No.:
- 348-978
- Mfr. Part No.:
- FF6MR12W2M1HPB11BPSA1
- Manufacturer:
- Infineon
Subtotal (1 unit)*
MYR1,876.97
FREE delivery for orders over RM 500.00
In Stock
- 18 unit(s) ready to ship from another location
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Units | Per Unit |
|---|---|
| 1 + | MYR1,876.97 |
*price indicative
- RS Stock No.:
- 348-978
- Mfr. Part No.:
- FF6MR12W2M1HPB11BPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 150A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Package Type | EasyDUAL | |
| Series | CoolSiC Trench MOSFET | |
| Mount Type | Screw | |
| Maximum Drain Source Resistance Rds | 11.6mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Source Voltage Vgs | 23 V | |
| Maximum Power Dissipation Pd | 20mW | |
| Forward Voltage Vf | 5.35V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | IEC 60747, IEC 60749, IEC 60068 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 150A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Package Type EasyDUAL | ||
Series CoolSiC Trench MOSFET | ||
Mount Type Screw | ||
Maximum Drain Source Resistance Rds 11.6mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Source Voltage Vgs 23 V | ||
Maximum Power Dissipation Pd 20mW | ||
Forward Voltage Vf 5.35V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals IEC 60747, IEC 60749, IEC 60068 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon EasyDUAL 2B CoolSiC MOSFET Half-Bridge Module is designed to deliver high performance power solutions with best-in-class packaging, featuring a compact 12 mm height for efficient space utilization. The module incorporates leading-edge Wide Bandgap (WBG) materials, providing superior efficiency, reliability, and thermal performance. With very low module stray inductance, it ensures minimized power losses and enhanced switching dynamics. The module is powered by the Enhanced CoolSiC MOSFET Gen 1, offering improved thermal management and efficiency, making it ideal for demanding power applications.
Outstanding module efficiency
System cost advantages
System efficiency improvement
Reduced cooling requirements
Enabling higher frequency
Increase of power density
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