Microchip, 8 bit PIC, PIC XLP 16F Microcontroller, 32 MHz, 7kB FLASH, 20-Pin DIP
- RS Stock No.:
- 236-8891P
- Mfr. Part No.:
- PIC16F15344-I/P
- Manufacturer:
- Microchip
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MYR152.28
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- 230 unit(s) ready to ship from another location
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Units | Per Unit |
|---|---|
| 20 + | MYR7.614 |
*price indicative
- RS Stock No.:
- 236-8891P
- Mfr. Part No.:
- PIC16F15344-I/P
- Manufacturer:
- Microchip
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Microchip | |
| Series | PIC XLP 16F | |
| Product Type | Microcontroller | |
| Package Type | DIP | |
| Mount Type | Through Hole | |
| Pin Count | 20 | |
| Device Core | PIC | |
| Data Bus Width | 8bit | |
| Program Memory Size | 7kB | |
| Maximum Clock Frequency | 32MHz | |
| Maximum Supply Voltage | 5.5V | |
| Analogue Comparators | 2 | |
| DACs | 1 x 5 Bit | |
| Number of Programmable I/Os | 18 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS3 | |
| Minimum Supply Voltage | 2.3V | |
| Instruction Set Architecture | Harvard | |
| Program Memory Type | FLASH | |
| Automotive Standard | No | |
| ADCs | 17 x 10 Bit | |
| Select all | ||
|---|---|---|
Brand Microchip | ||
Series PIC XLP 16F | ||
Product Type Microcontroller | ||
Package Type DIP | ||
Mount Type Through Hole | ||
Pin Count 20 | ||
Device Core PIC | ||
Data Bus Width 8bit | ||
Program Memory Size 7kB | ||
Maximum Clock Frequency 32MHz | ||
Maximum Supply Voltage 5.5V | ||
Analogue Comparators 2 | ||
DACs 1 x 5 Bit | ||
Number of Programmable I/Os 18 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS3 | ||
Minimum Supply Voltage 2.3V | ||
Instruction Set Architecture Harvard | ||
Program Memory Type FLASH | ||
Automotive Standard No | ||
ADCs 17 x 10 Bit | ||
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
C Compiler optimized RISC architecture
32 MHz clock input
125 ns minimum instruction cycle
Interrupt capability
16-Level deep hardware stack
8 bit Timer2 with hardware limit timer (HLT)
16-bit Timer0/1
Low current power on reset (POR)
Configurable power up timer (PWRTE)
Brown out reset (BOR)
low power BOR (LPBOR) option