Amphenol Communications Solutions 0.5 mm Pitch 262 Way, Right Angle Surface Mount Mount DDR5 DIMM Socket ,250 V ac,
- RS Stock No.:
- 263-3684P
- Mfr. Part No.:
- 10157591-002RHLF
- Manufacturer:
- Amphenol Communications Solutions
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 263-3684P
- Mfr. Part No.:
- 10157591-002RHLF
- Manufacturer:
- Amphenol Communications Solutions
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Latched | |
| Contact Material | Copper Alloy | |
| Current | 500mA | |
| Contact Plating | Gold | |
| Number of Contacts | 262 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Liquid Crystal Polymer | |
| SDRAM Type | DDR5 | |
| Minimum Operating Temperature | -40°C | |
| Latching | Yes | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS | |
| Maximum Contact Resistance | 1mΩ | |
| Series | 10157591 | |
| Voltage | 250 V ac | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Right Angle | ||
Insertion/Removal Method Latched | ||
Contact Material Copper Alloy | ||
Current 500mA | ||
Contact Plating Gold | ||
Number of Contacts 262 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Liquid Crystal Polymer | ||
SDRAM Type DDR5 | ||
Minimum Operating Temperature -40°C | ||
Latching Yes | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS | ||
Maximum Contact Resistance 1mΩ | ||
Series 10157591 | ||
Voltage 250 V ac | ||
- COO (Country of Origin):
- CN
The Amphenol DDR5 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, it consume lower power and promote better thermal management.
Withstands high temperature IR flow
LCP, halogen free, housing material