OIS-170-775-X-T EPIGAP OSA Photonics, OIS-170 775nm IR LED, 0805 SMD package
- RS Stock No.:
- 173-6317P
- Mfr. Part No.:
- OIS-170-775-X-T
- Manufacturer:
- EPIGAP OSA Photonics
Bulk discount available
Subtotal 130 units (supplied on a continuous strip)*
MYR517.27
FREE delivery for orders over RM 500.00
In Stock
- Plus 480 unit(s) shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 130 - 240 | MYR3.979 |
| 250 + | MYR3.859 |
*price indicative
- RS Stock No.:
- 173-6317P
- Mfr. Part No.:
- OIS-170-775-X-T
- Manufacturer:
- EPIGAP OSA Photonics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Peak Wavelength | 775nm | |
| Package Type | 0805 | |
| Radiant Intensity | 2.8mW/sr | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 1.9 x 1.2 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-170 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Maximum Supply Voltage | 2.1V | |
| Select all | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Peak Wavelength 775nm | ||
Package Type 0805 | ||
Radiant Intensity 2.8mW/sr | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 1.9 x 1.2 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-170 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
Maximum Supply Voltage 2.1V | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 1.9mm x 1.2mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
circuit substrate:glass laminated epoxy
lead free solderable, soldering pads: Gold plated
taped in 8 mm blister tape, cathod to transporting perforation
all devices sorted into luminous intensity classes
size: 1.9mm x 1.2mm x 1.2mm
circuit substrate:glass laminated epoxy
lead free solderable, soldering pads: Gold plated
taped in 8 mm blister tape, cathod to transporting perforation
all devices sorted into luminous intensity classes