Infineon FP15R12KE3GBPSA1 3 Phase IGBT, 25 A 1.2 kV AG-ECONO2C-311, Chassis
- RS Stock No.:
- 258-0856
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
This image is representative of the product range
Bulk discount available
View bulk pricing optionsSubtotal (1 tray of 15 units)*
MYR7,598.81
FREE delivery for orders over RM 150.00
Temporarily out of stock
- Shipping from 18 January 2027
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Units | Per Unit | Per Tray* |
|---|---|---|
| 15 - 15 | MYR506.587 | MYR7,598.81 |
| 30 - 30 | MYR455.931 | MYR6,838.97 |
| 45 + | MYR410.333 | MYR6,155.00 |
*price indicative
- RS Stock No.:
- 258-0856
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current Ic | 25A | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1.2kV | |
| Maximum Power Dissipation Pd | 105W | |
| Configuration | 3 Phase | |
| Package Type | AG-ECONO2C-311 | |
| Mount Type | Chassis | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 125°C | |
| Length | 107.5mm | |
| Standards/Approvals | RoHS | |
| Height | 17mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current Ic 25A | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1.2kV | ||
Maximum Power Dissipation Pd 105W | ||
Configuration 3 Phase | ||
Package Type AG-ECONO2C-311 | ||
Mount Type Chassis | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 125°C | ||
Length 107.5mm | ||
Standards/Approvals RoHS | ||
Height 17mm | ||
Automotive Standard No | ||
The Infineon EconoPIM 2 1200V three phase PIM IGBT module with IGBT3 and NTC is optimized customers development cycle time and cost, its fast, reliable and low cost mounting concept.
Low stray inductance module design
High reliability and power density
Copper base plate for optimized heat spread
Solder able pins
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