TE Connectivity 0.1 in Pitch DIP Board DIP IC Socket
- RS Stock No.:
- 817-447
- Mfr. Part No.:
- 2-1437539-6
- Manufacturer:
- TE Connectivity
N
Subtotal (1 tube of 60 units)*
MYR1,591.03
Stock information currently inaccessible - Please check back later
Tube(s) | Per Tube | Per Unit* |
|---|---|---|
| 1 + | MYR1,591.03 | MYR26.517 |
*price indicative
- RS Stock No.:
- 817-447
- Mfr. Part No.:
- 2-1437539-6
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| IC Socket Type | DIP | |
| Package Type | DIP | |
| Current | 3A | |
| Number of Rows | 2 | |
| Pitch | 0.1in | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper | |
| Contact Plating | Gold | |
| Termination Type | Through-Hole Solder Terminal | |
| Minimum Operating Temperature | -55°C | |
| Socket Mount Type | Board | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 105°C | |
| Series | 800 | |
| Standards/Approvals | UL 94V 0 | |
| Housing Material | Polyester | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
IC Socket Type DIP | ||
Package Type DIP | ||
Current 3A | ||
Number of Rows 2 | ||
Pitch 0.1in | ||
Orientation Vertical | ||
Contact Material Beryllium Copper | ||
Contact Plating Gold | ||
Termination Type Through-Hole Solder Terminal | ||
Minimum Operating Temperature -55°C | ||
Socket Mount Type Board | ||
Device Mount Type Board | ||
Maximum Operating Temperature 105°C | ||
Series 800 | ||
Standards/Approvals UL 94V 0 | ||
Housing Material Polyester | ||
Non Compliant
- COO (Country of Origin):
- CH
The TE Connectivity DIP Socket with Four-Fingered Contact is designed to provide a reliable connection for integrated circuits. Its construction allows effortless IC mating and facilitates quick component replacement.
Offers a precision four-finger contact design for reliable connections
Supported by a low profile insulator, suitable for space-constrained applications
Non-wicking closed bottom prevents solder or flux ingress
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