TE Connectivity 600 μm Pitch 40 Way DIP-14 Through Hole DIP Socket
- RS Stock No.:
- 815-223
- Mfr. Part No.:
- 7-1437536-4
- Manufacturer:
- TE Connectivity
N
Subtotal (1 box of 36 units)*
MYR1,409.23
Stock information currently inaccessible - Please check back later
Box(es) | Per Box | Per Unit* |
|---|---|---|
| 1 + | MYR1,409.23 | MYR39.145 |
*price indicative
- RS Stock No.:
- 815-223
- Mfr. Part No.:
- 7-1437536-4
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | Socket | |
| Package Type | DIP-14 | |
| IC Socket Type | DIP | |
| Number of Contacts | 40 | |
| Current | 3A | |
| Number of Rows | 2 | |
| Pitch | 600μm | |
| Voltage | 250V | |
| Orientation | Vertical | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold over Nickel | |
| Row Pitch | 600μm | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Socket Mount Type | Through Hole | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 105°C | |
| Series | 500 Series | |
| Standards/Approvals | UL 94V-0 | |
| Housing Material | Polyester | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type Socket | ||
Package Type DIP-14 | ||
IC Socket Type DIP | ||
Number of Contacts 40 | ||
Current 3A | ||
Number of Rows 2 | ||
Pitch 600μm | ||
Voltage 250V | ||
Orientation Vertical | ||
Contact Material Copper Alloy | ||
Contact Plating Gold over Nickel | ||
Row Pitch 600μm | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Socket Mount Type Through Hole | ||
Device Mount Type Board | ||
Maximum Operating Temperature 105°C | ||
Series 500 Series | ||
Standards/Approvals UL 94V-0 | ||
Housing Material Polyester | ||
Non Compliant
- COO (Country of Origin):
- CH
The TE Connectivity DIP socket designed for reliable electronic connections, ensuring a robust Interface for easy integration into circuit designs.
Insulation resistance of 5,000 MW provides enhanced durability
Non-compliant with RoHS/ELV standards, offering flexibility in usage
Features a contact resistance of 10 mΩ for optimal performance
Capable of soldering at temperatures up to 245°C, ensuring adaptability in various manufacturing processes
Constructed with Beryllium Copper for superior conductivity
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