Winslow Straight Through Hole Mount 0.65 mm, 2.54 mm Pitch IC Socket Adapter, TSOP 24 to DIP 24
- RS Stock No.:
- 741-9423
- Mfr. Part No.:
- W9528RC
- Manufacturer:
- Winslow
This image is representative of the product range
Bulk discount available
Subtotal (1 pack of 5 units)*
MYR454.16
FREE delivery for orders over RM 500.00
In Stock
- Plus 45 unit(s) shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 370 | MYR90.832 | MYR454.16 |
| 375 - 1995 | MYR88.926 | MYR444.63 |
| 2000 + | MYR86.256 | MYR431.28 |
*price indicative
- RS Stock No.:
- 741-9423
- Mfr. Part No.:
- W9528RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.65 mm, 2.54 mm | |
| End 1 | TSOP 24 | |
| End 2 | DIP 24 | |
| End 1 Number of Contacts | 24 | |
| End 2 Number of Contacts | 24 | |
| End 1 Type | TSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.65 mm, 2.54 mm | ||
End 1 TSOP 24 | ||
End 2 DIP 24 | ||
End 1 Number of Contacts 24 | ||
End 2 Number of Contacts 24 | ||
End 1 Type TSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
