Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSSOP 20 to DIP 20
- RS Stock No.:
- 741-9417
- Mfr. Part No.:
- W9576RC
- Manufacturer:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
MYR236.50
FREE delivery for orders over RM 500.00
In Stock
- Plus 45 unit(s) shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 370 | MYR47.30 | MYR236.50 |
| 375 - 1995 | MYR46.306 | MYR231.53 |
| 2000 + | MYR44.92 | MYR224.60 |
*price indicative
- RS Stock No.:
- 741-9417
- Mfr. Part No.:
- W9576RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSSOP 20 | |
| End 2 | DIP 20 | |
| End 1 Number of Contacts | 20 | |
| End 2 Number of Contacts | 20 | |
| End 1 Type | TSSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSSOP 20 | ||
End 2 DIP 20 | ||
End 1 Number of Contacts 20 | ||
End 2 Number of Contacts 20 | ||
End 1 Type TSSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
