Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SSOP to DIP
- RS Stock No.:
- 741-9420
- Mfr. Part No.:
- W9593RC
- Manufacturer:
- Winslow
This image is representative of the product range
Bulk discount available
Subtotal (1 pack of 5 units)*
MYR397.16
FREE delivery for orders over RM 500.00
Temporarily out of stock
- Shipping from 11 May 2026
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Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 370 | MYR79.432 | MYR397.16 |
| 375 - 1995 | MYR76.646 | MYR383.23 |
| 2000 + | MYR73.078 | MYR365.39 |
*price indicative
- RS Stock No.:
- 741-9420
- Mfr. Part No.:
- W9593RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SSOP | |
| Number of Contacts A | 28 | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Number of Contacts B | 28 | |
| Connection B | DIP | |
| Contact Plating | Tin over Nickel | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Contact Material | Brass | |
| Standards/Approvals | No | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SSOP | ||
Number of Contacts A 28 | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Number of Contacts B 28 | ||
Connection B DIP | ||
Contact Plating Tin over Nickel | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Contact Material Brass | ||
Standards/Approvals No | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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