Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, 100 Pin Female QFP to 100 Pin Male PGA
- RS Stock No.:
- 285-4641
- Mfr. Part No.:
- WA10050DQAETRC
- Manufacturer:
- Winslow
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Subtotal (1 unit)*
MYR214.69
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- 4 unit(s) ready to ship from another location
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Units | Per Unit |
|---|---|
| 1 - 24 | MYR214.69 |
| 25 - 99 | MYR210.18 |
| 100 + | MYR203.88 |
*price indicative
- RS Stock No.:
- 285-4641
- Mfr. Part No.:
- WA10050DQAETRC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | 100 Pin Female QFP | |
| End 2 | 100 Pin Male PGA | |
| End 1 Number of Contacts | 100 | |
| End 2 Number of Contacts | 100 | |
| End 1 Type | QFP | |
| End 2 Type | PGA | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 100 Pin Female QFP | ||
End 2 100 Pin Male PGA | ||
End 1 Number of Contacts 100 | ||
End 2 Number of Contacts 100 | ||
End 1 Type QFP | ||
End 2 Type PGA | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
QFP to PGA One Piece Sockets
Standard 'Adaptics' stu suit a broad range of QFPs for both development and production requirements. A low cost solution which converts a QFP IC to the data sheet PGA footprint.
PCB: Epoxy Fibreglass FR4
Pins: Brass
Plating: Tin over Nickel
Pins: Brass
Plating: Tin over Nickel
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.