Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 24 Pin Female SOIC to 24 Pin Male DIP
- RS Stock No.:
- 158-2963
- Mfr. Part No.:
- W9507RC
- Manufacturer:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
MYR301.96
Stock information currently inaccessible
Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 120 | MYR60.392 | MYR301.96 |
| 125 - 370 | MYR58.916 | MYR294.58 |
| 375 - 995 | MYR56.696 | MYR283.48 |
| 1000 - 1995 | MYR54.332 | MYR271.66 |
| 2000 + | MYR53.048 | MYR265.24 |
*price indicative
- RS Stock No.:
- 158-2963
- Mfr. Part No.:
- W9507RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 1.27 mm, 2.54 mm | |
| End 1 | 24 Pin Female SOIC | |
| End 2 | 24 Pin Male DIP | |
| End 1 Number of Contacts | 24 | |
| End 2 Number of Contacts | 24 | |
| End 1 Type | SOIC | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Gold over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 1.27 mm, 2.54 mm | ||
End 1 24 Pin Female SOIC | ||
End 2 24 Pin Male DIP | ||
End 1 Number of Contacts 24 | ||
End 2 Number of Contacts 24 | ||
End 1 Type SOIC | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Gold over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.