Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SOP to DIP
- RS Stock No.:
- 158-2929
- Mfr. Part No.:
- W9505RC
- Manufacturer:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
MYR217.38
FREE delivery for orders over RM 500.00
In Stock
- 95 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 120 | MYR43.476 | MYR217.38 |
| 125 - 495 | MYR42.604 | MYR213.02 |
| 500 + | MYR41.754 | MYR208.77 |
*price indicative
- RS Stock No.:
- 158-2929
- Mfr. Part No.:
- W9505RC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SOP | |
| Number of Contacts A | 20 | |
| Connection Gender A | Female | |
| Number of Contacts B | 20 | |
| Connection Gender B | Male | |
| Connection B | DIP | |
| Pitch | 2.54mm | |
| Series | SOP-DIP Iss5 | |
| Contact Plating | Gold over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SOP | ||
Number of Contacts A 20 | ||
Connection Gender A Female | ||
Number of Contacts B 20 | ||
Connection Gender B Male | ||
Connection B DIP | ||
Pitch 2.54mm | ||
Series SOP-DIP Iss5 | ||
Contact Plating Gold over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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