Fischer Elektronik Heatsink, Universal Square Alu 12.3 mm 43.6 mm 43.6mm
- RS Stock No.:
- 674-4737
- Mfr. Part No.:
- ICK PGA 17x17x12
- Manufacturer:
- Fischer Elektronik
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View bulk pricing optionsSubtotal (1 unit)*
MYR29.67
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In Stock
- 12 unit(s) ready to ship from another location
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Units | Per Unit |
|---|---|
| 1 - 49 | MYR29.67 |
| 50 - 99 | MYR29.08 |
| 100 - 249 | MYR28.50 |
| 250 + | MYR27.93 |
*price indicative
- RS Stock No.:
- 674-4737
- Mfr. Part No.:
- ICK PGA 17x17x12
- Manufacturer:
- Fischer Elektronik
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 43.6mm | |
| Width | 43.6mm | |
| Height | 12.3mm | |
| Fastening | Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Heat Sink For Bga, Heat Sink For Pentium Pro, Heat Sink For Pentium III/Xeon, Ic Processors, PGA, Semiconductor, SMD, Fan, Pin Heat Sinks, Heatsink for PGA, Power PC, Heat Sink For IC, Bga, Microprocessor, Cooler, PLCC, Heat Sink For III Mobile Module | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 43.6mm | ||
Width 43.6mm | ||
Height 12.3mm | ||
Fastening Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Heat Sink For Bga, Heat Sink For Pentium Pro, Heat Sink For Pentium III/Xeon, Ic Processors, PGA, Semiconductor, SMD, Fan, Pin Heat Sinks, Heatsink for PGA, Power PC, Heat Sink For IC, Bga, Microprocessor, Cooler, PLCC, Heat Sink For III Mobile Module | ||
- COO (Country of Origin):
- DE
ICK PGA Series
Heatsinks for IC processor
Black anodised surface
Mounting by thermally conductive foil or thermally conductive adhesive（Therm.conductive foil or therm.cond. adhesive are not provided for fixation）