Microchip Xplained Pro WINC3400 Bluetooth, WiFi Development Kit for WINC3400-MR210CA Module 20 MHz ATWINC3400-XPRO

Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
RS Stock No.:
144-9441
Mfr. Part No.:
ATWINC3400-XPRO
Manufacturer:
Microchip
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Brand

Microchip

RF Technology

Bluetooth, WiFi

Product Type

Communication & Wireless Development Tool

Kit Classification

Development Kit

Technology

Baseband, RF, MAC Network Controller with Integrated Low Energy Bluetooth

For Use With

WINC3400-MR210CA Module

Featured Device

WINC3400

Kit Name

Xplained Pro

Maximum Frequency

20MHz

Standards/Approvals

IEEE 802.11 b/g/n, Bluetooth 4.0

COO (Country of Origin):
US
The ATWINC3400-XPRO evaluation kit is a hardware platform to evaluate the WINC3400-MR210CA module. The WINC3400 is an IEEE 802.11 b/g/n/BLE4.0 IoT network controller SoC. It is the ideal add-on to existing MCU solutions bringing Wi-Fi and BLE Network capabilities through SPI-to-Wi-Fi interface. The WINC3400 connects to any PIC or SAM MCU with minimal resource requirements. The WINC3400's most advanced mode is a single stream 1x1 802.11n mode providing up to 72 Mbps PHY throughput. The WINC3400 features fully-integrated Power Amplifier, LNA, Switch and Power Management. It also features an on-chip microcontroller and integrated flash memory for system software with built in coexistence mechanism for concurrent Wi-Fi & BLE functionality. The only external clock source needed for the WINC3400 is a high-speed crystal or oscillator running at 26 MHz. The WINC3400 is available in a QFN package or as a fully certified module.

IEEE 802.11: IEEE 802.11 b/g/n 20MHz (1x1) solution

IEEE 802.11: Single spatial stream in 2.4GHz ISM band

IEEE 802.11: Integrated PA and T/R Switch

IEEE 802.11: Superior Sensitivity and Range via advanced PHY signal processing

IEEE 802.11: Operating temperature range of -40C to +85C

IEEE 802.11: On-Chip Network Stack to offload MCU

IEEE 802.11: Integrated Network IP stack to minimize host CPU requirements

IEEE 802.11: Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS

Bluetooth: On-Chip Network Stack to offload MCU

Bluetooth: BLE 4.0

Bluetooth: Class 2 transmission

Bluetooth: Adaptive Frequency Hopping

Bluetooth: Integrated PA and T/R Switch

Bluetooth: Superior Sensitivity and Range

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