LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC Suitable for high speed printing up to 150 mm/s Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection
Designed for printing, pin-in-paste and enclosed head print capability Excellent wetting to a broad range of metallization Compatible with existing halogen-free solutions Suitable for medium to large board assemblies
