Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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Subtotal (1 pack of 5 units)*

MYR46.84

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Units
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Per Pack*
5 - 95MYR9.368MYR46.84
100 - 370MYR9.172MYR45.86
375 - 1495MYR8.894MYR44.47
1500 - 2995MYR8.672MYR43.36
3000 +MYR8.486MYR42.43

*price indicative

Packaging Options:
SEA- RSPROC&C-PDP-1025
RS Stock No.:
670-2171
Mfr. Part No.:
43650-0424
Manufacturer:
Molex
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Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Housing Material

High Temperature Thermoplastic

Number of Contacts

4

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-62-232

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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