Infineon FS1150R08A8P3LMCHPSA1, Type N-Channel Half Bridge IGBT, 600 A 750 V, Screw
- RS Stock No.:
- 349-029
- Mfr. Part No.:
- FS1150R08A8P3LMCHPSA1
- Manufacturer:
- Infineon
Subtotal (1 unit)*
MYR5,455.40
FREE delivery for orders over RM 500.00
Temporarily out of stock
- Shipping from 21 September 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 1 + | MYR5,455.40 |
*price indicative
- RS Stock No.:
- 349-029
- Mfr. Part No.:
- FS1150R08A8P3LMCHPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 600A | |
| Maximum Collector Emitter Voltage Vceo | 750V | |
| Maximum Power Dissipation Pd | 1kW | |
| Number of Transistors | 6 | |
| Configuration | Half Bridge | |
| Mount Type | Screw | |
| Channel Type | Type N | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.22V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 185°C | |
| Standards/Approvals | RoHS, UL 94 V0 | |
| Automotive Standard | AQG 324 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 600A | ||
Maximum Collector Emitter Voltage Vceo 750V | ||
Maximum Power Dissipation Pd 1kW | ||
Number of Transistors 6 | ||
Configuration Half Bridge | ||
Mount Type Screw | ||
Channel Type Type N | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.22V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 185°C | ||
Standards/Approvals RoHS, UL 94 V0 | ||
Automotive Standard AQG 324 | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineons next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
Related links
- Infineon FS1150R08A8P3LBCHPSA1 1.15 kA 750 V AQG-324, Screw
- Infineon FF1200XTR17T2P5PBPSA1 1200 A 1700 V, Screw
- Infineon FF2400R12IP7PBPSA1 2400 A 1200 V Module, Screw
- Infineon FF2400R12IP7BPSA1 2400 A 1200 V Module, Screw
- Infineon FS03MR12A7MA2BHPSA1 310 A 1200 V HybridPACK Drive G2, Screw
- Infineon FF1600R12IP7BOSA1 1600 A 1200 V PrimePACKTM2, Screw
- Infineon FF1800XTR17T2P5PBPSA1 1800 A 1700 V XHP-2, Screw
- Vishay VS-GT200TS065S 476 A 650 V Panel
