Bergquist 3500ULM Series Self-Adhesive Thermal Interface Pad, 0.508 → 3.175mm Thick, 3.5W/m·K, Silicone

The Bergquist n extremely soft gap filling material with a thermal conductivity of 3.5 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per m K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness.

Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress