Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 12 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header ensures a dependable connection in various applications, especially in power and wire-to-board configurations. The Micro-Fit 3.0 connector features a shrouded design that enhances safety and usability, providing a secure fit for demanding requirements within the automation and electronics sectors.

• Brass contacts deliver high conductivity and durability
• Glow wire compatible, designed to withstand high-temperature ratings
• Vertical orientation facilitates streamlined integration into various devices

• Utilised for power distribution in printed circuit boards
• Compatible with microcontrollers and electronic devices

The maximum current rating is 5A per contact, ensuring adequate performance for various setups. Ensure your configuration does not exceed this rating.

Solder the component through the designated holes on the PCB for a secure fit. Ensure correct alignment before soldering.

Yes, multiple headers can be employed, as long as they do not surpass the collective current limitations of your circuit.

The advised PCB thickness for this header is 1.60mm, which ensures optimal retention and connection integrity.

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Molex Micro-Fit 3.0 Series