Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Plastic peg PCB locks for secure connection to PCB
• Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This header from Molex's Micro-Fit 3.0 series has a right-angled orientation to save space on your PCB (printed circuit board) and reduce strain on cables. It's a reliable and compact 4-way header with a 3.0mm pitch and is used in low-range to mid-range power distribution. The housing is made from a high-temperature liquid crystal polymer that's able to handle the high temperatures (up to +265°C) that occur during the infra-red reflow soldering process. The contacts are fully isolated inside the housing to reduce arcing.

• Locking ramps on the housing offer positive latching to prevent accidental disconnection
• Tin-plated contacts resist corrosion to ensure excellent conductivity and reliable data transfer
• Plastic peg PCB locks make a secure connection to the PCB
• Through-hole mounting and solder termination make a strong connection with the board

• Data communications
• Solar power installations
• Gaming terminals

Molex's Micro-Fit system is a compact and versatile series of connectors available in multiple circuit sizes and cable lengths. These components are used for board-to-board, wire-to-board and wire-to-wire configurations.

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Molex Micro-Fit 3.0 Series