Monolithic structure provides higher reliability. A wide range of capacitance values available in standard case sizes. The use of nickel as electrode material and plating processing improve the solderability and heat resistance characteristics. It also prevents migration and raises the level of reliability Low equivalent series resistance(ESR) provides superior noise absorption characteristics
Item Summary 10uF±20%, 6.3V, X7R, 0805/2012 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping Embossed 3000pcs
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.