Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil
- RS Stock No.:
- 674-4765
- Mfr. Part No.:
- ICK BGA 35x35x10
- Manufacturer:
- Fischer Elektronik
44 In Global stock for delivery in 4-6 working days, delivery time may vary for certain locations or FTZ
125 In Global stock for delivery in 4-6 working days, delivery time may vary for certain locations or FTZ
Added
Price Each
MYR8.14
| Units | Per Unit |
| 1 - 49 | MYR8.14 |
| 50 - 99 | MYR7.97 |
| 100 - 249 | MYR7.73 |
| 250 + | MYR7.51 |
- RS Stock No.:
- 674-4765
- Mfr. Part No.:
- ICK BGA 35x35x10
- Manufacturer:
- Fischer Elektronik
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- DE
Product Details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
Specifications
Attribute | Value |
|---|---|
| For Use With | Universal Square Alu |
| Length | 35mm |
| Width | 35mm |
| Height | 10mm |
| Dimensions | 35 x 35 x 10mm |
| Thermal Resistance | 15.7K/W |
| Mounting | Adhesive Foil, Conductive Foil |
| Colour | Black |
| Package Type | BGA |
| Material | Aluminium |