TE Connectivity 0.5mm Pitch 260 Way SMT SO DIMM Socket ,25 V ac ,500mA

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.

Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
High Performance Computing (HPC)
Mass storages
Communication equipment
Desktop PCs
Instrument equipment

Attribute Value
Gender Female
Body Orientation Right Angle
Contact Material Copper Alloy
Contact Plating Gold Flash, Nickel Plated (Under Plated)
Number of Contacts 260
Pitch 0.5mm
Mounting Type Surface Mount
Termination Method Solder
Housing Material Thermoplastic
Latching Yes
Row Spacing 8.2mm
Maximum Contact Resistance 50mΩ
Current Rating 500mA
Series Number 2309414
Maximum Operating Temperature -55°C
Voltage Rating 25 V ac
Minimum Operating Temperature +85°C
Temporarily out of stock - back order for despatch 21/08/2020, delivery within 4 working days from despatch date
Price Each (On a Tape of 5)
MYR 8.374
Per unit
Per Tape*
5 - 20
25 - 45
50 - 95
100 +
*price indicative
Packaging Options:
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