2.0mm,Crimp,Contact

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CN
Product Details

The wire-to-board High Performance Interconnect (HPI) connector system is available in 1.0mm, 1.25mm, 1.5mm, 2.0mm, and 2.5mm centerline pitch. This connector system ofers vertical and horizontal (right angle) connector mounting for versatility, and the square-peg technology enables product compatibility with industry standard products. TE Connectivity’s HPI products can be used anywhere a signal or low power needs to be routed through a device. If your customer’s application has more than one printed circuit board then HPI product is an option to connect the PCBs.

1.0mm – 2.5mm centerline
Vertical & Horizontal PCB Mount
Through Hole (DIP) & Surface Mount Termination (SMT)
Polarized
Partially and fully shrouded
Square termination posts
Provides design flexibility
Cost efective wire-to-board
Ensures proper compatibility of both the header and the housing
Prevents stubbing contacts
Enables inter-changeability with industry standard designs
Applications
Business & Retail Equipment
Consumer Devices
Industrial
Automotive
Medical
Appliance

Specifications
Attribute Value
Gender Female
For Use With 1735447-x- 2041423-x Connectors
Minimum Wire Size mm² 0.02mm²
Maximum Wire Size mm² 0.05mm²
Termination Method Crimp
Contact Plating Tin
Minimum Wire Size AWG 30AWG
Contact Material Phosphor Bronze
Maximum Wire Size AWG 24AWG
Series Number 1735801
Maximum Contact Resistance 20mΩ
Minimum Operating Temperature -25°C
Maximum Operating Temperature +105°C
Temporarily out of stock - back order for despatch 13/07/2020, delivery within 4 working days from despatch date
Price Each (On a Reel of 10000)
MYR 0.039
units
Per unit
Per Reel*
10000 - 10000
MYR0.039
MYR390.00
20000 +
MYR0.038
MYR380.00
*price indicative