Potting Compounds

Potting compounds are a general-purpose types of sealant that can offer environmental, mechanical and physical protection to circuit boards and electronic assemblies. Used in electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which provides protection from moisture, vibration, thermal or physical shock and general contamination. The mechanical protection enables the components to maintain high performance under extreme conditions. Thermosetting plastics or silicone rubber gels are often used.

Types of compounds

Epoxy Potting Compounds - Epoxy potting compounds generally perform as a better adhesive, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predictable. They have good high temperature resistance up to 400°F.

Urethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are an excellent selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the properties.

Silicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures.

Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials. They benefit from very fast hardening, adequate chemical resistance and are clear in appearance.

Applications of Potting Compounds

Potting compounds are used in a range of applications such as;

  • Military
  • Industrial
  • Automotive industry
  • PCB's
  • Coils

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Description Price Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS Stock No. 283-460
Mfr. Part No.QSIL-553
MYR325.71
Each
units
QSil 553, QSil 553, QSil 553 Silicone Dual Cartridge 250 g Thermal Conductivity 24 h 32 Shore A 0.68W/mK Grey +260°C -55°C - - -
RS Stock No. 448-0236
Mfr. Part No.740010360
MYR120.18
Each
units
AS1621, AS1621, AS1621 Silicone Cartridge 310 ml - 24 h 24 Shore A 0.2W/mK White +230°C -50°C - - -
RS Stock No. 194-4684
Mfr. Part No.520005402
MYR1,000.48
1 Kit
Kit(s)
QSil 553, QSil 553, QSil 553 Silicone Kit - Thermal Conductivity 24 h @ 25 °C, 7 min @ 100°C - 0.68W/mK - +260°C -55°C - - -
RS Stock No. 146-3072
Mfr. Part No.SE3000
MYR1,135.29
Each
units
SE3000, SE3000, SE3000 Silicone Kit 2 kg Low Modulus, Low Viscosity, Low Volatility, Neutral & Non-Corrosive, Thermally Conductive 24 h 40 Shore A 1.17W/mK Grey, Orange +250°C -70°C Silicone 14kV/mm -
RS Stock No. 146-3069
Mfr. Part No.E-GEL 3000
MYR1,280.36
Each
units
EGel3000, EGel3000, EGel3000 Silicone Kit 2 kg - 7 days - - Transparent +200°C -55°C Silicone >18.5kV/mm -