Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
- RS Stock No.:
- 752-4897
- Mfr. Part No.:
- HF650P-0.001-01-00-43
- Manufacturer:
- Bergquist
Discontinued product
- RS Stock No.:
- 752-4897
- Mfr. Part No.:
- HF650P-0.001-01-00-43
- Manufacturer:
- Bergquist
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad
Specifications
Attribute | Value |
|---|---|
| Thickness | 0.001in |
| Thermal Conductivity | 1.5W/m·K |
| Material | Hi-Flow 650P |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -40°C |
| Maximum Operating Temperature | +150°C |
| Material Trade Name | Hi-Flow 650P |
| Operating Temperature Range | -40 → +150 °C |