- RS Stock No.:
- 127-041
- Mfr. Part No.:
- HF225FAC-0.004-AC-1112
- Manufacturer:
- Bergquist
Discontinued product
- RS Stock No.:
- 127-041
- Mfr. Part No.:
- HF225FAC-0.004-AC-1112
- Manufacturer:
- Bergquist
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
Specifications
Attribute | Value |
---|---|
Dimensions | 11 x 12in |
Thickness | 0.102mm |
Length | 11in |
Width | 12in |
Thermal Conductivity | 1W/m·K |
Material | Hi-Flow 225F-AC |
Self-Adhesive | Yes |
Maximum Operating Temperature | +120°C |
Material Trade Name | Hi-Flow 225F-AC |
Operating Temperature Range | Maximum of +120 °C |