MBO Paste Lead Free Solder, +217°C Melting Point

  • RS Stock No. 555-193
  • Mfr. Part No. CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU
  • Manufacturer MBO
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): FR
Product Details

Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5

No-Clean solder paste suitable for stencil printing for reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.

Solder Paste - Lead Free

Specifications
Attribute Value
Percent Lead 0%
Product Form Paste
Melting Point +217°C
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Product Weight 30g
Flux Content Percent 14%
Percent Copper 0.5%
In Global stock for delivery within 4 - 6 working days.
Price Each
MYR 86.54
units
Per unit
1 - 9
MYR86.54
10 - 19
MYR84.82
20 - 49
MYR83.50
50 +
MYR79.90
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