TE Connectivity AMPMODU System 50 Series 1.27mm Pitch 10 Way 2 Row Straight PCB Socket, Surface Mount

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles

AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.


UL 94V-0

TE Connectivity AMPMODU 50/50 1.27mm Connectors

The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.

Attribute Value
Number of Contacts 10
Number of Rows 2
Pitch 1.27mm
Type Socket Strip
Mounting Type Surface Mount
Body Orientation Straight
Termination Method Solder
Current Rating 4A
Voltage Rating 30 V ac
Series AMPMODU System 50
Contact Material Copper Alloy
2957 In Global stock for delivery within 4 - 6 working days
Price Each
MYR 13.42
Per unit
1 - 19
20 - 74
75 - 299
300 - 599
600 +
Packaging Options: