Heatsink, BGA, 42.5 x 42.5 x 25mm, Clip

  • RS Stock No. 489-6164
  • Mfr. Part No. MBH42.5002-25P/2.6
  • Manufacturer Malico
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): TW
Product Details

BGA Chipset Heat Sinks

High-performance precision-forged clip-attachment heatsinks for BGA chipsets.

AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop

BGA Heatsinks

Specifications
Attribute Value
For Use With Clip
Length 42.5mm
Width 42.5mm
Height 25mm
Dimensions 42.5 x 42.5 x 25mm
Mounting Clip
Colour Black
15 In Global stock for delivery within 4 - 6 working days
Price Each
MYR 36.87
units
Per unit
1 - 49
MYR36.87
50 - 99
MYR32.38
100 - 249
MYR27.85
250 - 499
MYR23.34
500 +
MYR18.80
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